New packaging solutions for cookies and chocolate bars to be unveiled at Interpack 2023

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Syntegon is set to unveil its latest hardware at Interpack 2023. Pic: Syntegon

Syntegon is set to showcase its line expertise in horizontal packaging solutions for cookies and bars at this year’s Interpack trade fair in Germany.

The  company said the new Syntegon IDH is at the heart of a line that flexibly packages cookies and crackers in trays and flow wraps made of mono-material - and thanks to a new pick-and-place technology with integrated linear motors, it handles products particularly gently.

In addition to gentle handling, the high-performance system for bars that will be on show offers high levels of sustainability and digitalization. The line is equipped with a paper-ON-form forming shoulder and wraps bars in paper before placing them in glueless formed cartons in the TTM1 topload cartoner with an integrated lock-style forming station. Moreover, Syntegon will present a new wireless Human Machine Interface (HMI) that allows operators to access all available information and digital services at any time.

At its booth, visitors can experience the full pack style flexibility of the IDH in combination with an HCS form, fill and seal machine live for the first time. The pick-and-place solution for handling and portioning cookies is based on a newly developed technology, said Daniel Bossel, Product Manager at Syntegon.

 “Thanks to integrated linear motors, each picker can be individually aligned, allowing them to process even random product streams. The number of pickers can be increased to up to 40. At interpack, the IDH achieves a maximum output of up to 800 products per minute – while still maintaining its space-saving design.

“Consistent gentle product handling is one of Syntegon's strengths and especially important when processing sensitive products. Therefore, the linear motors are also part of the downstream feeding module FIF. They move particularly slowly and smoothly to protect products from mechanical stress, thus minimizing product loss.”

At interpack, the FIF feeding module is integrated into an HCS form, fill and seal machine and feeds the cookies in piles, slugs or trays into the packaging machine. The HCS then wraps them in recyclable film made of mono-material and heat-seals all formats for airtight packs and optimal product protection.

  • Interpack 2023 takes place in Düsseldorf, Germany, from 4 May to 10 May.